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 |
¡¡ |
 |
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 |
Capability |
|
|
|
Ø
Layer Count |
£º |
2~28 Layer
Rigid Board |
|
Ø
Material |
£º |
High Tg, Low
Dk,FR-4,RCC,Rogers,Green
laminate |
|
Ø
Minimum Line
Width/Space |
£º |
0.05mm/0.05mm |
|
Ø
Aspect Ratio |
£º |
9 |
|
Ø
Min Drill
Size |
£º |
0.2mm |
|
Ø
Min Laser
Drill Size |
£º |
0.1mm |
|
Ø
Overall
Board
Thickness |
£º |
0.25mm ~
4.57mm |
|
Ø
Surface
Finish |
£º |
HASL¡¢Ni/Au¡¢OSP¡¢Immersion
Silver |
|
Ø
Via Hole
Technology |
£º |
PTH¡¢Baried/Blind
via¡¢Stack
Via¡¢Via
Filled |
|
Ø
Impedance
|
£º |
¡À
7.5% |
|
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| ¡¡ |
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